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All modern technology features micro- and nano-fabricated components such as electrical logic elements and memories, nanomechanical filters and sensors, lasers and photodetectors.

The Optoelectronic Integration Facility (OIF) allows us to integrate these diverse components into application-ready technologies.

It provides capabilities for flip-chip bonding, die-bonding, housing, fibre optic pigtailing, alignment of active and passive photonic components, and wire bonding.

Location and equipment

Based in the Parnell Building (Building 7), the facility comprises interconnected rooms that are dedicated to optoelectronic and mechanical integration and packaging.

Its state-of-the-art equipment includes:

  • a fibre alignment and pigtailing system to connect fabricated devices to fibre optics
  • a die bonder to enable advanced chip-level integration processes such as flip-chip bonding, 3D packaging, chip-to-glass bonding and sensor packaging
  • a HEPA-filtered workstation with cleanroom class 100 laminar air flow to protect the die bonder from particulates
  • a critical point dryer to aid in processing fragile devices.

Wider applications

The OIF is widely applicable outside of photonic and quantum sensors, and has capabilities to integrate nanoelectronic and microfluidic systems, laser and terahertz sources, and energy harvesting devices.

The facility is available to UQ researchers and industry partners, and provides an enhanced student learning environment with strong pathways to high-skilled jobs.